EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
EDN

Rohm and Haas Unveils New ACuPLANE™ Copper Barrier CMP Solution

HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
Houston Chronicle

(BW) Air Liquide Electronics Thinks Outside the Fab for Copper Cleaning Applications

Chemical Mechanical Planarization is a semiconductor manufacturing process that uses slurries consisting of abrasive particles and ancillary chemicals to clean and condition semiconductor wafers ...
Semiconductor Engineering

Addressing Thin Film Thickness Metrology Challenges Of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and ...