Semiconductor Engineering

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...
Mena FN

Global White Label Computer Peripheral Packaging Market Led By Asia Pacific As Huhtamaki Expands Supply

(MENAFN- EIN Presswire) EINPresswire/ -- The global white-label computer peripheral packaging market is positioned for steady expansion, with a projected valuation increase from USD 535.5 million in ...
Business Wire

Origin Materials and Packaging Matters Launch Partnership to Develop Advanced Carbon-Negative Packaging Solutions, Building on Existing 10-Year Supply Agreement

Packaging Matters and Origin Materials will partner to develop advanced packaging materials, including polyethylene furanoate, “PEF,” a next-generation polymer. The project will leverage Origin ...