Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional ...

Electronics components testing must occur before and after manufacturing, and producers should never treat that step as an afterthought. Here are some of the practical advantages that a thorough ...

Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...

Balancing yield and test is essential to semiconductor manufacturing, but it’s becoming harder to determine how much weight to give one versus the other as chips become more specialized for different ...

As additive manufacturing (AM) parts become more complex, so does the testing. To accommodate the testing of AM metal parts, Plastometrex uses profilometry-based indentation plastometry (PIP). PIP can ...