An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Semes, a semiconductor equipment company, said on the 16th that it has developed for mass production, for the first time in Korea, the TEPAS100, a sorter for large semiconductor panel-level package ...