Hermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in advanced ...

Combine scalable analytics with advanced AI capabilities like LLMs and agentic tasks to create a new chipmaking platform.

Scientists are striving to discover new semiconductor materials that could boost the efficiency of solar cells and other electronics. But the pace of innovation is bottlenecked by the speed at which ...

FormFactor (FORM) is a $2.5 billion OEM of automated wafer probe cards and other testing devices used in the back-end portion of the semiconductor manufacturing process. FORM serves the requirements ...

KLA Instruments™, a division of KLA Corporation, has expanded its defect inspection and metrology portfolio in 2023 to include new systems for semiconductor process development and control, including ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

FormFactor is experiencing strong growth in high-bandwidth memory (HBM) probe card demand, with HBM revenue nearly doubling in Q1 2024 compared to H2 2023. The company is benefiting from the increased ...

In the era of megatrends such as electric vehicles (EVs), new technologies are emerging to keep up with evolving demands. One example of this is the evolution of compound semiconductors that use ...

As we approach the physical limits of semiconductors, new technologies are required to develop advanced chips. New materials, device types and more efficient architectures and packaging are necessary ...

10 BEST Focused Suppliers of Chip Making Equipment, THE BEST Suppliers of Test Subsystems, and THE BEST Suppliers of Assembly Test Equipment. In this survey, worldwide semiconductor manufacturing ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

Guadalajara plan expands ASE’s global footprint, increases presence in North America The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the ...