Electronics components are steadily moving away from through hole parts to using surface mount technology (SMT) exclusively. While the small size of the SMT components can be intimidating, with a ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...

Soldering uses alloys that melt below 840°F to join metals. Molten solder fills the space between surfaces to be joined, adheres to the surfaces, and solidifies. Typical soldering steps include: ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...