Artificial Intelligence has become a pervasive technology that is being applied to solve today’s complex problems, especially in the areas involving exponentially large amounts of data, their analysis ...

In today’s competitive semiconductor market, revenue growth is often associated with design innovation, process advancements, or packaging breakthroughs. However, a powerful and frequently overlooked ...

In my May 2020 CW column, I introduced a new test method for measuring the fracture toughness within the facesheet-to-core interface region of sandwich composites. This proposed test method, referred ...

In my July 2005 column, a new ASTM standard shear test method was introduced 1. At that time, I raised the question, Why do we need another shear test method for composite materials?, with the promise ...