Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for ...
Carbon nanotubes can be five times as energy efficient and five times faster than silicon. engineers at the University of Wisconsin–Madison can align the nanotubes for computer chips by turning them ...
PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. (Nanowerk News) PI ...
NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...
Across the semiconductor industry, ensuring cleanrooms and mini-environments are sufficiently monitored for particle sizes down to 100 nm is a common practice. Most industries have adopted this ...
Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...