The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the successful production of the world’s first semiconductor wafer whose ...

FREMONT, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received over $2 ...