Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...
Semiconductor manufacturing operates at extraordinary precision. In advanced fabrication processes, temperature stability ...
To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...
Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...
Aimed at prototyping single- or multi-chip verifications or small volume production runs, Hsinchu, Taiwan-based wafer foundry Taiwan Semiconductor Manufacturing Co. Inc. (TSMC) today launched what it ...
Ben Kitson, head of business development at chemical etching specialist Precision Micro, explains why semiconductor cooling ...
Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are ...
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