With two out of ten approved semiconductor projects nationwide located in the state, Odisha is positioning itself as a ...
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Majhi, Vaishnaw Unveil India's First Advanced 3D Chip Packaging Unit In Bhubaneswar
The total investment in the project is Rs 1,943.53 crore, including approved Central fiscal support of Rs 799 crore and additional state support of approximately Rs 399.5 crore.
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China unveils 2,372°F battery firewall material aimed at stopping EV fires
A single lithium-ion battery cell in thermal runaway can spike past 1,000 degrees Celsius in seconds. In a tightly packed EV ...
Houston GMC Sierra owner Brent Jones is skipping the 2026 Toyota Tundra, choosing to wait for 2027 models instead. Why the ...
Data backs up the product’s resonance with lifestyle and instant imaging enthusiasts. Chee has revealed that over half of ...
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Odisha emerges as fast-growing IT and semiconductor hub with strong electronics manufacturing push: Union Minister Ashwini Vaishnaw
The foundation stone of the Heterogeneous Integration Packaging Solutions project, promoted by 3D Glass Solutions, was laid ...
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